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PCE
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DIFF Subgroup
H10P 54/92

for protecting or reinforcing the surface of wafers or substrates during cutting or separating, e.g. using adhesive tapes

Introduced: January 2026

Full Title

Cutting or separating of wafers, substrates or parts of devices > Auxiliary processes or arrangements > for protecting or reinforcing the surface of wafers or substrates during cutting or separating, e.g. using adhesive tapes

Of 2 combined children, 0 exist in both systems.

2 codes are CPC-only extensions.

Child Classifications

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