DIFF Subgroup
H10P 72/04 Full Title
Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
Of 11 combined children, 0 exist in both systems.
11 codes are CPC-only extensions.
H10P 72/04 Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
Of 11 combined children, 0 exist in both systems.
11 codes are CPC-only extensions.