DIFF Subgroup
H10P 72/06 Full Title
Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
Of 8 combined children, 0 exist in both systems.
8 codes are CPC-only extensions.
H10P 72/06 Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
Of 8 combined children, 0 exist in both systems.
8 codes are CPC-only extensions.