Handling or holding of wafers, substrates or devices during manufacture or treatment thereof

Introduced: January 2026

Of 6 combined children, 4 exist in both systems.

2 codes are CPC-only extensions.

IPC defines codes here since 2026.

Child Classifications

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H10P 72/04 +11 CPC CPC only CPC only
H10P 72/06 +8 CPC CPC only CPC only
H10P 72/10 using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] since 2026 +8 CPC IPC+CPC Available in IPC and CPC
H10P 72/30 for conveying, e.g. between different workstations since 2026 +6 CPC IPC+CPC Available in IPC and CPC
H10P 72/50 for positioning, orientation or alignment since 2026 +2 CPC IPC+CPC Available in IPC and CPC
H10P 72/70 for supporting or gripping since 2026 +1 CPC IPC+CPC Available in IPC and CPC