H10W 20/211 — IPC vs CPC Diff | Patent Classification Explorer

DIFF Subgroup

H10W 20/211

Full Title

Interconnections in chips, wafers or substrates > Interconnections within wafers or substrates, e.g. through-silicon vias [TSV]

Of 6 combined children, 0 exist in both systems.

6 codes are CPC-only extensions.

This code exists only in CPC.

Diff view requires codes present in both systems.