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PCE
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DIFF Subgroup
H10W 40/80

Circuit arrangements for thermal protection or control of packages

Introduced: January 2026

Full Title

Full titles differ between systems:

IPC:

Arrangements for thermal protection or thermal control > Circuit arrangements for thermal protection or control of packages

CPC:

Arrangements for thermal protection or thermal control (integrated devices comprising arrangements for thermal protection H10D89/60) > Circuit arrangements for thermal protection or control of packages

No child classifications to compare. This is a leaf node in both IPC and CPC.