Arrangements for thermal protection or thermal control (integrated devices comprising arrangements for thermal protection H10D89/60)

Child Classifications

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• H10W 40/01 +1 CPC CPC only CPC only
• H10W 40/10 Arrangements for heating since 2026 IPC+CPC Available in IPC and CPC
• H10W 40/20 Arrangements for cooling since 2026 +1 CPC IPC+CPC Available in IPC and CPC
• H10W 40/30 wherein the packaged device is completely immersed in a fluid other than air, e.g. immersed in a cryogenic fluid since 2026 +1 CPC IPC+CPC Available in IPC and CPC
• H10W 40/40 involving heat exchange by flowing fluids since 2026 IPC+CPC Available in IPC and CPC
• H10W 40/50 Arrangements for sensing temperature since 2026 IPC+CPC Available in IPC and CPC
• H10W 40/60 Securing means for detachable heating or cooling arrangements, e.g. clamps since 2026 +3 CPC IPC+CPC Available in IPC and CPC
• H10W 40/70 Fillings or auxiliary members in containers or in encapsulations for thermal protection or control since 2026 IPC+CPC Available in IPC and CPC
• H10W 40/80 Circuit arrangements for thermal protection or control of packages since 2026 IPC+CPC Available in IPC and CPC