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PCE
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DIFF Subgroup
H10W 74/15

on active surfaces of flip-chip devices, e.g. underfills

Introduced: January 2026

Full Title

Encapsulations, e.g. protective coatings > characterised by their shape or disposition > on active surfaces of flip-chip devices, e.g. underfills

No child classifications to compare. This is a leaf node in both IPC and CPC.