on active surfaces of flip-chip devices, e.g. underfills

Full Title

Encapsulations, e.g. protective coatings > characterised by their shape or disposition > on active surfaces of flip-chip devices, e.g. underfills

Classification Context

Section:

ELECTRICITY

Class:

SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR

Subclass:

GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS