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IPC Subclass
B81C

PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS

Introduced: January 2000

Classification Context

Section:
PERFORMING OPERATIONS; TRANSPORTING
Class:
MICROSTRUCTURAL TECHNOLOGY
Subclass:
PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS

Description

B81C covers manufacturing and treatment processes specifically designed for microstructural devices and systems, typically encompassing micromachining, lithography, deposition, etching, and assembly techniques used to create microscale structures. This classification includes apparatus and methods for producing components with feature dimensions generally in the micrometer to nanometer range, such as microelectromechanical systems (MEMS), microfluidic devices, and integrated microstructures. It excludes general semiconductor manufacturing (covered under H01L) and focuses on the specialized processes and equipment required when the dimensional precision, aspect ratios, or structural complexity demand techniques beyond conventional manufacturing. Related technologies within B81C include bulk micromachining, surface micromachining, wafer bonding, and the integration of multiple microstructural components into functional systems.

Additional Content

Glossary

manufacture a chemical, electrical, or mechanical process or apparatus for accomplishing one or more of the following operations on a micromechanical device, microstructure, or micro system proper for this subclass: assembling, associating, bonding, casting, coating, constructing, creating, cutting, distorting, electric photographing, etching, fabricating, fastening, finishing, joining, juxtaposing, machining, molding, positioning, shaping, or working. microelectronic device microelectronic devices any kind of electronic device that has at least one essential operational component not visible without the use of an optical microscope. microoptical device microoptical devices any kind of optical device that has at least one essential operational component not visible without the use of an optical microscope. microsized having a dimension not visible without the use of an optical microscope (e.g., typically within the range of 10 -4 to 10 -7 meters). structural function structural functions effect of structural features of a microstructure on the mechanical properties of media in contact with the microstructure (e.g., directing of a sampled fluid's flow).

Limiting references

Chemical or physical processes or relevant apparatus for making microcapsules or microballoons Specially adapted processes or apparatus restricted to the manufacture or treatment of products that are essentially two-dimensional [2D] layered structures Specially adapted processes or apparatus involved in the manufacture of atomic scale structures produced by manipulation of atoms or molecules Processes or apparatus peculiar to the manufacture or treatment of piezo-electric, electrostrictive, or magnetostrictive elements per se Processes or apparatus specially adapted to the manufacture or treatment of wave-guide microstrips

Related Keywords

manufacture or treatment of MEMSmanufacture or treatment of MICRO-ELECTRO-MECHANICAL SYSTEMSmanufacture or treatment of MICROMECHANICAL DEVICESmanufacture or treatment of MICROSTRUCTURAL DEVICES

3 direct subcodes

Child Classifications

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  • B81C 1/00 Manufacture or treatment of devices or systems in or on a substrate
  • B81C 3/00 Assembling of devices or systems from individually processed components
  • B81C 99/00 Subject matter not provided for in other groups of this subclass

Top Applicants

Top 10 applicants by patent filingsfor class B81, 2013–2023, worldwide · Source: EPO PATSTAT

  1. ROBERT BOSCH DE 2,338
  2. INFINEON TECHNOLOGIES DE 702
  3. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 691
  4. CHINESE ACADEMY OF SCIENCES 508
  5. CEA (COMMISSARIAT A L'ENERGIE ATOMIQUE) FR 507
  6. SEIKO EPSON CORPORATION 484
  7. HEWLETT-PACKARD DEVELOPMENT COMPANY US 439
  8. INVENSENSE US 378
  9. STMICROELECTRONICS IT 365
  10. FRAUNHOFER DE 337