IPC Subgroup
G01K 5/62 the solid body being formed of compounded strips or plates, e.g. bimetallic strip
Introduced: September 1968
Last revised: January 2006
Full Title
Measuring temperature based on the expansion or contraction of a material > the material being a solid > constrained so that expansion or contraction causes a deformation of the solid > the solid body being formed of compounded strips or plates, e.g. bimetallic strip
Classification Context
- Section:
- PHYSICS
- Class:
- MEASURING; TESTING
- Subclass:
- MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
Related Keywords
BIMETALLIC elements for thermometry
2 direct subcodes
Child Classifications
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Top Applicants
Top 10 applicants by patent filingsfor class G01, 2013–2023, worldwide · Source: EPO PATSTAT
- SGCC(STATE GRID CORPORATION OF CHINA) 41,447
- CHINESE ACADEMY OF SCIENCES 32,952
- ROBERT BOSCH DE 16,470
- SAMSUNG ELECTRONICS COMPANY KR 10,052
- SINOPEC (CHINA PETROCHEMICAL CORPORATION) 9,573
- ZHEJIANG UNIVERSITY 9,529
- GUANGDONG POWER GRID CORPORATION 8,615
- TSINGHUA UNIVERSITY 7,805
- HALLIBURTON ENERGY SERVICES GROUP US 7,796
- QUALCOMM US 7,171