IPC Main Group
G06F 111/00 Details relating to CAD techniques
Introduced: January 2020
Classification Context
- Section:
- PHYSICS
- Class:
- COMPUTING OR CALCULATING; COUNTING
- Subclass:
- ELECTRIC DIGITAL DATA PROCESSING
10 direct subcodes
Child Classifications
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- G06F 111/02 CAD in a network environment, e.g. collaborative CAD or distributed simulation
- G06F 111/04 Constraint-based CAD
- G06F 111/06 Multi-objective optimisation, e.g. Pareto optimisation using simulated annealing [SA], ant colony algorithms or genetic algorithms [GA]
- G06F 111/08 Probabilistic or stochastic CAD
- G06F 111/1 Numerical modelling
- G06F 111/12 Symbolic schematics
- G06F 111/14 related to nanotechnology
- G06F 111/16 Customisation or personalisation
- G06F 111/18 using virtual or augmented reality
- G06F 111/2 Configuration CAD, e.g. designing by assembling or positioning modules selected from libraries of predesigned modules
Top Applicants
Top 10 applicants by patent filingsfor class G06, 2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG ELECTRONICS COMPANY KR 66,669
- IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 62,313
- MICROSOFT TECHNOLOGY LICENSING US 41,918
- GOOGLE US 32,969
- SGCC(STATE GRID CORPORATION OF CHINA) 30,822
- INTEL CORPORATION US 30,010
- TENCENT TECHNOLOGY (SHENZHEN) COMPANY 28,235
- HUAWEI TECHNOLOGIES COMPANY CN 26,079
- APPLE US 21,891
- HUAWEI TECHNOLOGIES COMPANY 20,505