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IPC Main Group
G06F 111/00

Details relating to CAD techniques

Introduced: January 2020

Classification Context

Section:
PHYSICS
Class:
COMPUTING OR CALCULATING; COUNTING
Subclass:
ELECTRIC DIGITAL DATA PROCESSING

10 direct subcodes

Child Classifications

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  • G06F 111/02 CAD in a network environment, e.g. collaborative CAD or distributed simulation
  • G06F 111/04 Constraint-based CAD
  • G06F 111/06 Multi-objective optimisation, e.g. Pareto optimisation using simulated annealing [SA], ant colony algorithms or genetic algorithms [GA]
  • G06F 111/08 Probabilistic or stochastic CAD
  • G06F 111/1 Numerical modelling
  • G06F 111/12 Symbolic schematics
  • G06F 111/14 related to nanotechnology
  • G06F 111/16 Customisation or personalisation
  • G06F 111/18 using virtual or augmented reality
  • G06F 111/2 Configuration CAD, e.g. designing by assembling or positioning modules selected from libraries of predesigned modules

Top Applicants

Top 10 applicants by patent filingsfor class G06, 2013–2023, worldwide · Source: EPO PATSTAT

  1. SAMSUNG ELECTRONICS COMPANY KR 66,669
  2. IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 62,313
  3. MICROSOFT TECHNOLOGY LICENSING US 41,918
  4. GOOGLE US 32,969
  5. SGCC(STATE GRID CORPORATION OF CHINA) 30,822
  6. INTEL CORPORATION US 30,010
  7. TENCENT TECHNOLOGY (SHENZHEN) COMPANY 28,235
  8. HUAWEI TECHNOLOGIES COMPANY CN 26,079
  9. APPLE US 21,891
  10. HUAWEI TECHNOLOGIES COMPANY 20,505