IPC Subgroup
G06F 111/02 CAD in a network environment, e.g. collaborative CAD or distributed simulation
Introduced: January 2020
Full Title
Details relating to CAD techniques > CAD in a network environment, e.g. collaborative CAD or distributed simulation
Classification Context
- Section:
- PHYSICS
- Class:
- COMPUTING OR CALCULATING; COUNTING
- Subclass:
- ELECTRIC DIGITAL DATA PROCESSING
Top Applicants
Top 10 applicants by patent filingsfor class G06, 2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG ELECTRONICS COMPANY KR 66,669
- IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 62,313
- MICROSOFT TECHNOLOGY LICENSING US 41,918
- GOOGLE US 32,969
- SGCC(STATE GRID CORPORATION OF CHINA) 30,822
- INTEL CORPORATION US 30,010
- TENCENT TECHNOLOGY (SHENZHEN) COMPANY 28,235
- HUAWEI TECHNOLOGIES COMPANY CN 26,079
- APPLE US 21,891
- HUAWEI TECHNOLOGIES COMPANY 20,505