IPC Main Group
G06F 113/00 Details relating to the application field
Introduced: January 2020
Classification Context
- Section:
- PHYSICS
- Class:
- COMPUTING OR CALCULATING; COUNTING
- Subclass:
- ELECTRIC DIGITAL DATA PROCESSING
14 direct subcodes
Child Classifications
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- G06F 113/02 Data centres
- G06F 113/04 Power grid distribution networks
- G06F 113/06 Wind turbines or wind farms
- G06F 113/08 Fluids
- G06F 113/1 Additive manufacturing, e.g. three-dimensional [3D] printing
- G06F 113/12 Cloth
- G06F 113/14 Pipes
- G06F 113/16 Cables, cable trees or wire harnesses
- G06F 113/18 Chip packaging
- G06F 113/2 Packaging, e.g. boxes or containers
- G06F 113/22 Moulding
- G06F 113/24 Sheet material
- G06F 113/26 Composites
- G06F 113/28 Fuselage, exterior or interior
Top Applicants
Top 10 applicants by patent filingsfor class G06, 2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG ELECTRONICS COMPANY KR 66,669
- IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 62,313
- MICROSOFT TECHNOLOGY LICENSING US 41,918
- GOOGLE US 32,969
- SGCC(STATE GRID CORPORATION OF CHINA) 30,822
- INTEL CORPORATION US 30,010
- TENCENT TECHNOLOGY (SHENZHEN) COMPANY 28,235
- HUAWEI TECHNOLOGIES COMPANY CN 26,079
- APPLE US 21,891
- HUAWEI TECHNOLOGIES COMPANY 20,505