on wound resistive element

Introduced: July 1974

Last revised: January 2006

Full Title

Details > Housing; Enclosing; Embedding; Filling the housing or enclosure > the housing or enclosure being formed as coating or mould without outer sheath > on wound resistive element

Classification Context

Section:: ELECTRICITY
Class:: ELECTRIC ELEMENTS
Subclass:: RESISTORS

Top Applicants

Top 10 applicants by patent filingsfor class H01, 2013–2023, worldwide · Source: EPO PATSTAT

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 43,574
SAMSUNG ELECTRONICS COMPANY KR 42,206
LG CHEM KR 21,383
APPLIED MATERIALS US 20,441
LG ENERGY SOLUTION KR 20,279
SAMSUNG DISPLAY KR 19,725
CHINESE ACADEMY OF SCIENCES 19,400
TOYOTA MOTOR CORPORATION 18,819
SGCC(STATE GRID CORPORATION OF CHINA) 18,082
TOKYO ELECTRON JP 17,634