IPC Subgroup
H01R 13/502 composed of different pieces
Introduced: January 1980
Last revised: January 2006
Full Title
Details of coupling devices of the kinds covered by groups or > Bases; Cases > composed of different pieces
Classification Context
- Section:
- ELECTRICITY
- Class:
- ELECTRIC ELEMENTS
- Subclass:
- ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
4 direct subcodes
Child Classifications
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- H01R 13/504 different pieces being moulded, cemented, welded, e.g. ultrasonic welding, or swaged together
- H01R 13/506 assembled by snap action of the parts
- H01R 13/508 assembled by clip or spring
- H01R 13/512 assembled by screw or screws
Top Applicants
Top 10 applicants by patent filingsfor class H01, 2013–2023, worldwide · Source: EPO PATSTAT
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 43,574
- SAMSUNG ELECTRONICS COMPANY KR 42,206
- LG CHEM KR 21,383
- APPLIED MATERIALS US 20,441
- LG ENERGY SOLUTION KR 20,279
- SAMSUNG DISPLAY KR 19,725
- CHINESE ACADEMY OF SCIENCES 19,400
- TOYOTA MOTOR CORPORATION 18,819
- SGCC(STATE GRID CORPORATION OF CHINA) 18,082
- TOKYO ELECTRON JP 17,634