IPC Main Group
H01R 43/00 Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
Introduced: September 1968
Last revised: January 2006
Classification Context
- Section:
- ELECTRICITY
- Class:
- ELECTRIC ELEMENTS
- Subclass:
- ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
Filing statistics
IPC H01R 43/00 belongs to the parent subclass H01R, which recorded 480,976 patent applications worldwide between 2013 and 2023. Annual filings grew from 29,386 in 2013 to 56,173 in 2023 (+91%). The most active applicants in class H01 are TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY (43,574 applications), SAMSUNG ELECTRONICS COMPANY (42,206 applications) and LG CHEM (21,383 applications).
Source: EPO PATSTAT, worldwide filings
Related Keywords
ASSEMBLING of electric conductors or line connectors, e.g. battery terminalsJOINTS for electric conductors
14 direct subcodes
Child Classifications
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- H01R 43/01 for connecting unstripped conductors to contact members having insulation cutting edges
- H01R 43/02 for soldered or welded connections
- H01R 43/027 for connecting conductors by clips
- H01R 43/033 for wrapping or unwrapping wire connections
- H01R 43/04 for forming connections by deformation, e.g. crimping tool
- H01R 43/06 Manufacture of commutators
- H01R 43/1 Manufacture of slip-rings
- H01R 43/12 Manufacture of brushes
- H01R 43/14 Maintenance of current collectors, e.g. reshaping of brushes, cleaning of commutators
- H01R 43/16 for manufacturing contact members, e.g. by punching and by bending
- H01R 43/18 for manufacturing bases or cases for contact members
- H01R 43/2 for assembling or disassembling contact members with insulating base, case or sleeve
- H01R 43/26 for engaging or disengaging the two parts of a coupling device
- H01R 43/28 for wire processing before connecting to contact members, not provided for in groups
Top Applicants
Top 10 applicants by patent filingsfor class H01, 2013–2023, worldwide · Source: EPO PATSTAT
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 43,574
- SAMSUNG ELECTRONICS COMPANY KR 42,206
- LG CHEM KR 21,383
- APPLIED MATERIALS US 20,441
- LG ENERGY SOLUTION KR 20,279
- SAMSUNG DISPLAY KR 19,725
- CHINESE ACADEMY OF SCIENCES 19,400
- TOYOTA MOTOR CORPORATION 18,819
- SGCC(STATE GRID CORPORATION OF CHINA) 18,082
- TOKYO ELECTRON JP 17,634