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DIFF Main Group
H01R 43/00

Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors (of trolley lines B60M1/28)

Introduced: September 1968

Title

Titles differ between systems:

IPC: Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors

CPC: Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors (of trolley lines B60M1/28)

Full Title

Full titles differ between systems:

IPC:

Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors

CPC:

Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors (of trolley lines B60M1/28)

Of 17 combined children, 14 exist in both systems.

3 codes are CPC-only extensions.

2 shared codes have differing titles between IPC and CPC.

Child Classifications

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  • H01R 43/002 CPC only CPC only
  • H01R 43/005 CPC only CPC only
  • H01R 43/007 CPC only CPC only
  • H01R 43/10 Manufacture of slip-rings IPC+CPC Available in IPC and CPC
  • H01R 43/12 Manufacture of brushes IPC+CPC Available in IPC and CPC
  • H01R 43/14 Maintenance of current collectors, e.g. reshaping of brushes, cleaning of commutators IPC+CPC Available in IPC and CPC
  • H01R 43/16 for manufacturing contact members, e.g. by punching and by bending since 1985 IPC+CPC Available in IPC and CPC
  • H01R 43/18 for manufacturing bases or cases for contact members since 1985 IPC+CPC Available in IPC and CPC
  • H01R 43/26 for engaging or disengaging the two parts of a coupling device (structural association with two-part coupling device H01R13/629) since 1985 IPC+CPC Available in IPC and CPC
  • H01R 43/28 for wire processing before connecting to contact members, not provided for in groups H01R43/02 - H01R43/26 since 1985 IPC+CPC Available in IPC and CPC

Top Applicants

Top Applicants (IPC)

Class H01,2013–2023, worldwide · Source: EPO PATSTAT

  1. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 43,574
  2. SAMSUNG ELECTRONICS COMPANY KR 42,206
  3. LG CHEM KR 21,383
  4. APPLIED MATERIALS US 20,441
  5. LG ENERGY SOLUTION KR 20,279
  6. SAMSUNG DISPLAY KR 19,725
  7. CHINESE ACADEMY OF SCIENCES 19,400
  8. TOYOTA MOTOR CORPORATION 18,819
  9. SGCC(STATE GRID CORPORATION OF CHINA) 18,082
  10. TOKYO ELECTRON JP 17,634

Top Applicants (CPC)

Class H01,2013–2023, worldwide · Source: EPO PATSTAT

  1. SAMSUNG ELECTRONICS COMPANY KR 37,897
  2. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 36,116
  3. APPLIED MATERIALS US 21,640
  4. LG ENERGY SOLUTION KR 20,770
  5. LG CHEM KR 19,835
  6. TOKYO ELECTRON JP 18,519
  7. ROBERT BOSCH DE 14,595
  8. INTEL CORPORATION US 13,580
  9. MURATA MANUFACTURING COMPANY JP 12,151
  10. SAMSUNG SDI COMPANY KR 12,080