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IPC Main Group
H02K 9/00

Arrangements for cooling or ventilating

Introduced: September 1968

Last revised: January 2006

Classification Context

Section:
ELECTRICITY
Class:
GENERATION, CONVERSION, OR DISTRIBUTION OF ELECTRIC POWER
Subclass:
DYNAMO-ELECTRIC MACHINES

Filing statistics

IPC H02K 9/00 belongs to the parent subclass H02K, which recorded 426,168 patent applications worldwide between 2013 and 2023. Annual filings grew from 23,896 in 2013 to 46,626 in 2023 (+95%), peaking at 54,100 applications in 2020. The most active applicants in class H02 are SGCC(STATE GRID CORPORATION OF CHINA) (54,496 applications), MITSUBISHI ELECTRIC CORPORATION (10,495 applications) and TOYOTA MOTOR CORPORATION (9,464 applications).

Source: EPO PATSTAT, worldwide filings

Additional Content

Channels or ducts in parts of the magnetic circuit , Channels or ducts in or between conductors ,

9 direct subcodes

Child Classifications

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  • H02K 9/08 by gaseous cooling medium circulating wholly within the machine casing
  • H02K 9/22 by solid heat conducting material embedded in, or arranged in contact with, the stator or rotor, e.g. heat bridges
  • H02K 9/24 Protection against failure of cooling arrangements, e.g. due to loss of cooling medium or due to interruption of the circulation of cooling medium
  • H02K 9/26 Structural association of machines with devices for cleaning or drying cooling medium, e.g. with filters
  • H02K 9/28 Cooling of commutators, slip-rings or brushes, e.g. by ventilating

Top Applicants

Top 10 applicants by patent filingsfor class H02, 2013–2023, worldwide · Source: EPO PATSTAT

  1. SGCC(STATE GRID CORPORATION OF CHINA) 54,496
  2. MITSUBISHI ELECTRIC CORPORATION JP 10,495
  3. TOYOTA MOTOR CORPORATION 9,464
  4. GUANGDONG POWER GRID CORPORATION 9,339
  5. ROBERT BOSCH DE 8,226
  6. SIEMENS DE 8,218
  7. DENSO CORPORATION 7,063
  8. MITSUBISHI ELECTRIC CORPORATION 6,619
  9. SAMSUNG ELECTRONICS COMPANY KR 5,826
  10. GREE ELECTRIC APPLIANCES 5,094