Chemomechanical polishing [CMP]

Full Title

Grinding, lapping or polishing of wafers, substrates or parts of devices > Chemomechanical polishing [CMP]

Classification Context

Section:

ELECTRICITY

Class:

SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR

Subclass:

GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS