DIFF Subgroup
H10P 52/40 Chemomechanical polishing [CMP] (electrochemical mechanical polishing H10P52/20)
Introduced: January 2026
Title
Titles differ between systems:
IPC: Chemomechanical polishing [CMP]
CPC: Chemomechanical polishing [CMP] (electrochemical mechanical polishing H10P52/20)
Full Title
Full titles differ between systems:
IPC:
Grinding, lapping or polishing of wafers, substrates or parts of devices > Chemomechanical polishing [CMP]
CPC:
Grinding, lapping or polishing of wafers, substrates or parts of devices > Chemomechanical polishing [CMP] (electrochemical mechanical polishing H10P52/20)
Of 2 combined children, 0 exist in both systems.
2 codes are CPC-only extensions.
Child Classifications
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