for protecting or reinforcing the surface of wafers or substrates during cutting or separating, e.g. using adhesive tapes

Full Title

Cutting or separating of wafers, substrates or parts of devices > Auxiliary processes or arrangements > for protecting or reinforcing the surface of wafers or substrates during cutting or separating, e.g. using adhesive tapes

Classification Context

Section:

ELECTRICITY

Class:

SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR

Subclass:

GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS