Interconnections within wafers or substrates, e.g. through-silicon vias [TSV]

Full Title

Interconnections in chips, wafers or substrates > Interconnections within wafers or substrates, e.g. through-silicon vias [TSV]

Classification Context

Section:

ELECTRICITY

Class:

SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR

Subclass:

GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS