DIFF Subgroup
H10W 20/20 Interconnections within wafers or substrates, e.g. through-silicon vias [TSV]
Introduced: January 2026
Full Title
Interconnections in chips, wafers or substrates > Interconnections within wafers or substrates, e.g. through-silicon vias [TSV]
Of 3 combined children, 0 exist in both systems.
3 codes are CPC-only extensions.
Child Classifications
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