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IPC Subgroup
H10W 20/49

Adaptable interconnections, e.g. fuses or antifuses

Introduced: January 2026

Full Title

Interconnections in chips, wafers or substrates > Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes > Adaptable interconnections, e.g. fuses or antifuses

Classification Context

Section:
ELECTRICITY
Class:
SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
Subclass:
GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS

Filing statistics

The most active applicants in class H10 are SAMSUNG DISPLAY (21,044 applications), SAMSUNG ELECTRONICS COMPANY (14,774 applications) and LG DISPLAY COMPANY (9,454 applications).

Source: EPO PATSTAT, worldwide filings

Additional Content

antifuse antifuses a part of an interconnection that is capable of having its state changed from non-conductive to conductive fuse fuses a part of an interconnection that is capable of having its state changed from conductive to non-conductive

Top Applicants

Top 10 applicants by patent filingsfor class H10, 2013–2023, worldwide · Source: EPO PATSTAT

  1. SAMSUNG DISPLAY KR 21,044
  2. SAMSUNG ELECTRONICS COMPANY KR 14,774
  3. LG DISPLAY COMPANY KR 9,454
  4. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 8,301
  5. SEMICONDUCTOR ENERGY LABORATORY COMPANY JP 7,642
  6. BOE TECHNOLOGY GROUP COMPANY 6,845
  7. BOE TECHNOLOGY GROUP COMPANY CN 6,806
  8. SAMSUNG DISPLAY 6,577
  9. LG CHEM KR 5,461
  10. SEMICONDUCTOR ENERGY LABORATORY COMPANY 5,115