characterised by their insulating parts

Full Title

Interconnections in chips, wafers or substrates > Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes > characterised by their insulating parts

Classification Context

Section:

ELECTRICITY

Class:

SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR

Subclass:

GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS

Child Classifications

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• H10W 20/46 comprising air gaps
• H10W 20/47 comprising two or more dielectric layers having different properties, e.g. different dielectric constants
• H10W 20/48 Insulating materials thereof