Bond pads, in general

Full Title

Interconnections or connectors in packages > Bond pads, in general

Classification Context

Section:

ELECTRICITY

Class:

SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR

Subclass:

GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS

Scope Notes

Application references: Bond pads specially adapted for bump connectors Bond pads specially adapted for conductive adhesives Bond pads specially adapted for bond wires Bond pads specially adapted for strap connectors