IPC Main Group
H10W 72/00 Interconnections or connectors in packages
Introduced: January 2026
Classification Context
- Section:
- ELECTRICITY
- Class:
- SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- Subclass:
- GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS
Scope Notes
Glossary: connector connectors an element within a package for electrically or physically connecting chips or package parts to other chips, package parts, or a circuit board (e.g. to a printed circuit board [PCB]).
6 direct subcodes
Child Classifications
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- H10W 72/2 Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
- H10W 72/3 Die-attach connectors
- H10W 72/4 Anisotropic conductive adhesives
- H10W 72/5 Bond wires
- H10W 72/6 Strap connectors, e.g. thick copper clips for grounding of power devices
- H10W 72/9 Bond pads, in general