IPC Main Group
H10W 72/00 Interconnections or connectors in packages
Introduced: January 2026
Classification Context
- Section:
- ELECTRICITY
- Class:
- SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- Subclass:
- GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS
Filing statistics
The most active applicants in class H10 are SAMSUNG DISPLAY (21,044 applications), SAMSUNG ELECTRONICS COMPANY (14,774 applications) and LG DISPLAY COMPANY (9,454 applications).
Source: EPO PATSTAT, worldwide filings
Additional Content
connector connectors an element within a package for electrically or physically connecting chips or package parts to other chips, package parts, or a circuit board (e.g. to a printed circuit board [PCB]).
6 direct subcodes
Child Classifications
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- H10W 72/2 Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
- H10W 72/3 Die-attach connectors
- H10W 72/4 Anisotropic conductive adhesives
- H10W 72/5 Bond wires
- H10W 72/6 Strap connectors, e.g. thick copper clips for grounding of power devices
- H10W 72/9 Bond pads, in general
Top Applicants
Top 10 applicants by patent filingsfor class H10, 2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG DISPLAY KR 21,044
- SAMSUNG ELECTRONICS COMPANY KR 14,774
- LG DISPLAY COMPANY KR 9,454
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 8,301
- SEMICONDUCTOR ENERGY LABORATORY COMPANY JP 7,642
- BOE TECHNOLOGY GROUP COMPANY 6,845
- BOE TECHNOLOGY GROUP COMPANY CN 6,806
- SAMSUNG DISPLAY 6,577
- LG CHEM KR 5,461
- SEMICONDUCTOR ENERGY LABORATORY COMPANY 5,115