IPC Main Group
H10W 72/00 Interconnections or connectors in packages
Introduced: January 2026
Classification Context
- Section:
- ELECTRICITY
- Class:
- SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- Subclass:
- GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS
Additional Content
connector connectors an element within a package for electrically or physically connecting chips or package parts to other chips, package parts, or a circuit board (e.g. to a printed circuit board [PCB]).
6 direct subcodes
Child Classifications
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- H10W 72/2 Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
- H10W 72/3 Die-attach connectors
- H10W 72/4 Anisotropic conductive adhesives
- H10W 72/5 Bond wires
- H10W 72/6 Strap connectors, e.g. thick copper clips for grounding of power devices
- H10W 72/9 Bond pads, in general
Top Applicants
Top 10 applicants by patent filingsfor class H10, 2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG DISPLAY KR 21,044
- SAMSUNG ELECTRONICS COMPANY KR 14,774
- LG DISPLAY COMPANY KR 9,454
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 8,301
- SEMICONDUCTOR ENERGY LABORATORY COMPANY JP 7,642
- BOE TECHNOLOGY GROUP COMPANY 6,845
- BOE TECHNOLOGY GROUP COMPANY CN 6,806
- SAMSUNG DISPLAY 6,577
- LG CHEM KR 5,461
- SEMICONDUCTOR ENERGY LABORATORY COMPANY 5,115