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CPC Subgroup Additional Only
B81C 2201/0126

Processes for the planarization of structures not provided for in B81C2201/0119 - B81C2201/0125

Full Title

Manufacture or treatment of microstructural devices or systems > in or on a substrate > Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning > Processes for the planarization of structures > Processes for the planarization of structures not provided for in B81C2201/0119 - B81C2201/0125

Top Applicants

Top 10 applicants by patent filingsfor class B81, 2013–2023, worldwide · Source: EPO PATSTAT

  1. ROBERT BOSCH DE 1,976
  2. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 788
  3. INFINEON TECHNOLOGIES DE 759
  4. CEA (COMMISSARIAT A L'ENERGIE ATOMIQUE) FR 555
  5. STMICROELECTRONICS IT 526
  6. INVENSENSE US 430
  7. MURATA MANUFACTURING COMPANY JP 418
  8. SEIKO EPSON CORPORATION 338
  9. CHINESE ACADEMY OF SCIENCES 338
  10. FRAUNHOFER DE 297