Processes for the planarization of structures

Full Title

Manufacture or treatment of microstructural devices or systems > in or on a substrate > Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning > Processes for the planarization of structures

Child Classifications

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• B81C 2201/0119 involving only addition of materials, i.e. additive planarization
• B81C 2201/0121 involving addition of material followed by removal of parts of said material, i.e. subtractive planarization
• B81C 2201/0122 Selective addition
• B81C 2201/0123 Selective removal
• B81C 2201/0125 Blanket removal, e.g. polishing
• B81C 2201/0126 Processes for the planarization of structures not provided for in B81C2201/0119 - B81C2201/0125