CPC Subgroup Additional Only
B81C 2201/0146 Processes for removing material not provided for in B81C2201/0129 - B81C2201/0145
Full Title
Manufacture or treatment of microstructural devices or systems > in or on a substrate > Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning > Processes for removing material > Processes for removing material not provided for in B81C2201/0129 - B81C2201/0145
Top Applicants
Top 10 applicants by patent filingsfor class B81, 2013–2023, worldwide · Source: EPO PATSTAT
- ROBERT BOSCH DE 1,976
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 788
- INFINEON TECHNOLOGIES DE 759
- CEA (COMMISSARIAT A L'ENERGIE ATOMIQUE) FR 555
- STMICROELECTRONICS IT 526
- INVENSENSE US 430
- MURATA MANUFACTURING COMPANY JP 418
- SEIKO EPSON CORPORATION 338
- CHINESE ACADEMY OF SCIENCES 338
- FRAUNHOFER DE 297