CPC Subgroup Additional Only
B81C 2201/0128 Processes for removing material
Full Title
Manufacture or treatment of microstructural devices or systems > in or on a substrate > Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning > Processes for removing material
5 direct subcodes
Child Classifications
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- B81C 2201/0129 Diamond turning
- B81C 2201/013 Etching
- B81C 2201/0143 Focussed beam, i.e. laser, ion or e-beam
- B81C 2201/0145 Spark erosion
- B81C 2201/0146 Processes for removing material not provided for in B81C2201/0129 - B81C2201/0145
Top Applicants
Top 10 applicants by patent filingsfor class B81, 2013–2023, worldwide · Source: EPO PATSTAT
- ROBERT BOSCH DE 1,976
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 788
- INFINEON TECHNOLOGIES DE 759
- CEA (COMMISSARIAT A L'ENERGIE ATOMIQUE) FR 555
- STMICROELECTRONICS IT 526
- INVENSENSE US 430
- MURATA MANUFACTURING COMPANY JP 418
- SEIKO EPSON CORPORATION 338
- CHINESE ACADEMY OF SCIENCES 338
- FRAUNHOFER DE 297