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PCE
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CPC Subgroup
C23F 1/14

Aqueous compositions

Full Title

Etching metallic material by chemical means (manufacture of printing surfaces B41C; manufacture of printed circuits H05K) > Etching compositions (C23F1/44 takes precedence) > Aqueous compositions

3 direct subcodes

Child Classifications

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  • C23F 1/42 containing a dispersed water-immiscible liquid

Top Applicants

Top 10 applicants by patent filingsfor class C23, 2013–2023, worldwide · Source: EPO PATSTAT

  1. APPLIED MATERIALS US 10,596
  2. TOKYO ELECTRON JP 5,229
  3. LAM RESEARCH CORPORATION US 3,622
  4. NIPPON STEEL CORPORATION JP 3,171
  5. JFE STEEL JP 3,128
  6. ASM IP HOLDING NL 2,722
  7. ARCELORMITTAL LU 2,481
  8. TOKYO ELECTRON 2,359
  9. APPLIED MATERIALS 2,284
  10. CHINESE ACADEMY OF SCIENCES 2,110