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CPC Subgroup
C23F 1/16

Acidic compositions (C23F1/42 takes precedence)

Full Title

Etching metallic material by chemical means (manufacture of printing surfaces B41C; manufacture of printed circuits H05K) > Etching compositions (C23F1/44 takes precedence) > Aqueous compositions > Acidic compositions (C23F1/42 takes precedence)

6 direct subcodes

Child Classifications

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  • C23F 1/18 for etching copper or alloys thereof
  • C23F 1/20 for etching aluminium or alloys thereof
  • C23F 1/22 for etching magnesium or alloys thereof
  • C23F 1/26 for etching refractory metals
  • C23F 1/28 for etching iron group metals
  • C23F 1/30 for etching other metallic material

Top Applicants

Top 10 applicants by patent filingsfor class C23, 2013–2023, worldwide · Source: EPO PATSTAT

  1. APPLIED MATERIALS US 10,596
  2. TOKYO ELECTRON JP 5,229
  3. LAM RESEARCH CORPORATION US 3,622
  4. NIPPON STEEL CORPORATION JP 3,171
  5. JFE STEEL JP 3,128
  6. ASM IP HOLDING NL 2,722
  7. ARCELORMITTAL LU 2,481
  8. TOKYO ELECTRON 2,359
  9. APPLIED MATERIALS 2,284
  10. CHINESE ACADEMY OF SCIENCES 2,110