CPC Subgroup
H04N 25/70 SSIS architectures; Circuits associated therewith
Full Title
Circuitry of solid-state image sensors [SSIS]; Control thereof > SSIS architectures; Circuits associated therewith
7 direct subcodes
Child Classifications
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- H04N 25/701 Line sensors
- H04N 25/702 SSIS architectures characterised by non-identical, non-equidistant or non-planar pixel layout
- H04N 25/703 SSIS architectures incorporating pixels for producing signals other than image signals
- H04N 25/709 Circuitry for control of the power supply
- H04N 25/71 Charge-coupled device [CCD] sensors; Charge-transfer registers specially adapted for CCD sensors
- H04N 25/76 Addressed sensors, e.g. MOS or CMOS sensors
- H04N 25/79 Arrangements of circuitry being divided between different or multiple substrates, chips or circuit boards, e.g. stacked image sensors
Top Applicants
Top 10 applicants by patent filingsfor class H04, 2013–2023, worldwide · Source: EPO PATSTAT
- HUAWEI TECHNOLOGIES COMPANY CN 101,476
- QUALCOMM US 101,139
- SAMSUNG ELECTRONICS COMPANY KR 96,655
- TELEFONAKTIEBOLAGET LM ERICSSON (PUBL) SE 57,744
- LG ELECTRONICS KR 55,253
- HUAWEI TECHNOLOGIES COMPANY 54,181
- SONY CORPORATION JP 35,309
- ZTE CORPORATION CN 32,950
- INTEL CORPORATION US 27,533
- GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORPORATION CN 27,498