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CPC Subgroup
H04N 25/70

SSIS architectures; Circuits associated therewith

Full Title

Circuitry of solid-state image sensors [SSIS]; Control thereof > SSIS architectures; Circuits associated therewith

7 direct subcodes

Child Classifications

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  • H04N 25/702 SSIS architectures characterised by non-identical, non-equidistant or non-planar pixel layout
  • H04N 25/709 Circuitry for control of the power supply
  • H04N 25/79 Arrangements of circuitry being divided between different or multiple substrates, chips or circuit boards, e.g. stacked image sensors

Top Applicants

Top 10 applicants by patent filingsfor class H04, 2013–2023, worldwide · Source: EPO PATSTAT

  1. HUAWEI TECHNOLOGIES COMPANY CN 101,476
  2. QUALCOMM US 101,139
  3. SAMSUNG ELECTRONICS COMPANY KR 96,655
  4. TELEFONAKTIEBOLAGET LM ERICSSON (PUBL) SE 57,744
  5. LG ELECTRONICS KR 55,253
  6. HUAWEI TECHNOLOGIES COMPANY 54,181
  7. SONY CORPORATION JP 35,309
  8. ZTE CORPORATION CN 32,950
  9. INTEL CORPORATION US 27,533
  10. GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORPORATION CN 27,498