IPC Subgroup
H04N 25/7 SSIS architectures; Circuits associated therewith
Introduced: January 2023
Full Title
Circuitry of solid-state image sensors [SSIS]; Control thereof > SSIS architectures; Circuits associated therewith
Classification Context
- Section:
- ELECTRICITY
- Class:
- ELECTRIC COMMUNICATION TECHNIQUE
- Subclass:
- PICTORIAL COMMUNICATION, e.g. TELEVISION
Filing statistics
IPC H04N 25/7 belongs to the parent subclass H04N, which recorded 1,015,361 patent applications worldwide between 2013 and 2023. Annual filings grew from 76,403 in 2013 to 85,701 in 2023 (+12%), peaking at 118,798 applications in 2020. The most active applicants in class H04 are QUALCOMM (97,396 applications), HUAWEI TECHNOLOGIES COMPANY (96,502 applications) and SAMSUNG ELECTRONICS COMPANY (86,981 applications).
Source: EPO PATSTAT, worldwide filings
7 direct subcodes
Child Classifications
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- H04N 25/701 Line sensors
- H04N 25/702 SSIS architectures characterised by non-identical, non-equidistant or non-planar pixel layout
- H04N 25/703 SSIS architectures incorporating pixels for producing signals other than image signals
- H04N 25/709 Circuitry for control of the power supply
- H04N 25/71 Charge-coupled device [CCD] sensors; Charge-transfer registers specially adapted for CCD sensors
- H04N 25/76 Addressed sensors, e.g. MOS or CMOS sensors
- H04N 25/79 Arrangements of circuitry being divided between different or multiple substrates, chips or circuit boards, e.g. stacked image sensors
Top Applicants
Top 10 applicants by patent filingsfor class H04, 2013–2023, worldwide · Source: EPO PATSTAT
- QUALCOMM US 97,396
- HUAWEI TECHNOLOGIES COMPANY CN 96,502
- SAMSUNG ELECTRONICS COMPANY KR 86,981
- TELEFONAKTIEBOLAGET LM ERICSSON (PUBL) SE 55,869
- HUAWEI TECHNOLOGIES COMPANY 55,349
- LG ELECTRONICS KR 53,649
- CANON 33,341
- SONY CORPORATION JP 32,761
- ZTE CORPORATION CN 32,274
- GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORPORATION 28,327