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IPC Subgroup
H04N 25/7

SSIS architectures; Circuits associated therewith

Introduced: January 2023

Full Title

Circuitry of solid-state image sensors [SSIS]; Control thereof > SSIS architectures; Circuits associated therewith

Classification Context

Section:
ELECTRICITY
Class:
ELECTRIC COMMUNICATION TECHNIQUE
Subclass:
PICTORIAL COMMUNICATION, e.g. TELEVISION

7 direct subcodes

Child Classifications

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  • H04N 25/701 Line sensors
  • H04N 25/702 SSIS architectures characterised by non-identical, non-equidistant or non-planar pixel layout
  • H04N 25/709 Circuitry for control of the power supply
  • H04N 25/79 Arrangements of circuitry being divided between different or multiple substrates, chips or circuit boards, e.g. stacked image sensors

Top Applicants

Top 10 applicants by patent filingsfor class H04, 2013–2023, worldwide · Source: EPO PATSTAT

  1. QUALCOMM US 97,396
  2. HUAWEI TECHNOLOGIES COMPANY CN 96,502
  3. SAMSUNG ELECTRONICS COMPANY KR 86,981
  4. TELEFONAKTIEBOLAGET LM ERICSSON (PUBL) SE 55,869
  5. HUAWEI TECHNOLOGIES COMPANY 55,349
  6. LG ELECTRONICS KR 53,649
  7. CANON 33,341
  8. SONY CORPORATION JP 32,761
  9. ZTE CORPORATION CN 32,274
  10. GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORPORATION 28,327