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CPC Subgroup
H05K 1/183

associated with components mounted in and supported by recessed areas of the PCBs

Full Title

Printed circuits > structurally associated with non-printed electric components (H05K1/16 takes precedence) > associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] > associated with components mounted in and supported by recessed areas of the PCBs

Top Applicants

Top 10 applicants by patent filingsfor class H05, 2013–2023, worldwide · Source: EPO PATSTAT

  1. SAMSUNG ELECTRONICS COMPANY KR 9,981
  2. SAMSUNG DISPLAY KR 5,041
  3. LG ELECTRONICS KR 4,742
  4. PHILIP MORRIS PRODUCTS CH 4,411
  5. PANASONIC INTELLECTUAL PROPERTY JP 3,915
  6. PANASONIC INTELLECTUAL PROPERTY 3,471
  7. SAMSUNG ELECTRO-MECHANICS COMPANY KR 3,210
  8. MURATA MANUFACTURING COMPANY JP 3,191
  9. FUJI JP 2,987
  10. SIGNIFY HOLDING NL 2,907