CPC Subgroup
H05K 1/182 associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
Full Title
Printed circuits > structurally associated with non-printed electric components (H05K1/16 takes precedence) > associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
3 direct subcodes
Child Classifications
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- H05K 1/183 associated with components mounted in and supported by recessed areas of the PCBs
- H05K 1/184 associated with components inserted in holes through the PCBs and wherein terminals of the components are connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
- H05K 1/185 associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards
Top Applicants
Top 10 applicants by patent filingsfor class H05, 2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG ELECTRONICS COMPANY KR 9,981
- SAMSUNG DISPLAY KR 5,041
- LG ELECTRONICS KR 4,742
- PHILIP MORRIS PRODUCTS CH 4,411
- PANASONIC INTELLECTUAL PROPERTY JP 3,915
- PANASONIC INTELLECTUAL PROPERTY 3,471
- SAMSUNG ELECTRO-MECHANICS COMPANY KR 3,210
- MURATA MANUFACTURING COMPANY JP 3,191
- FUJI JP 2,987
- SIGNIFY HOLDING NL 2,907