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CPC Subgroup
H05K 1/18

structurally associated with non-printed electric components (H05K1/16 takes precedence)

Full Title

Printed circuits > structurally associated with non-printed electric components (H05K1/16 takes precedence)

Filing statistics

CPC H05K 1/18 belongs to the parent subclass H05K, which recorded 393,752 patent applications worldwide between 2013 and 2023. Annual filings grew from 26,893 in 2013 to 40,478 in 2023 (+51%), peaking at 44,441 applications in 2021. The most active applicants in class H05 are SAMSUNG ELECTRONICS COMPANY (9,981 applications), SAMSUNG DISPLAY (5,041 applications) and LG ELECTRONICS (4,742 applications).

Source: EPO PATSTAT, worldwide filings

3 direct subcodes

Child Classifications

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  • H05K 1/181 associated with surface mounted components
  • H05K 1/189 characterised by the use of flexible or folded printed circuits

Top Applicants

Top 10 applicants by patent filingsfor class H05, 2013–2023, worldwide · Source: EPO PATSTAT

  1. SAMSUNG ELECTRONICS COMPANY KR 9,981
  2. SAMSUNG DISPLAY KR 5,041
  3. LG ELECTRONICS KR 4,742
  4. PHILIP MORRIS PRODUCTS CH 4,411
  5. PANASONIC INTELLECTUAL PROPERTY JP 3,915
  6. PANASONIC INTELLECTUAL PROPERTY 3,471
  7. SAMSUNG ELECTRO-MECHANICS COMPANY KR 3,210
  8. MURATA MANUFACTURING COMPANY JP 3,191
  9. FUJI JP 2,987
  10. SIGNIFY HOLDING NL 2,907