CPC Subgroup Additional Only
H05K 2201/0104 Properties and characteristics in general
Full Title
Indexing scheme relating to printed circuits covered by H05K1/00 > Dielectrics > Properties and characteristics in general
7 direct subcodes
Child Classifications
Navigate with arrow keys, Enter to open
- H05K 2201/0108 Transparent
- H05K 2201/0112 Absorbing light, e.g. dielectric layer with carbon filler for laser processing
- H05K 2201/0116 Porous, e.g. foam
- H05K 2201/012 Flame-retardant; Preventing of inflammation
- H05K 2201/0125 Shrinkable, e.g. heat-shrinkable polymer
- H05K 2201/0129 Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
- H05K 2201/0133 Elastomeric or compliant polymer
Top Applicants
Top 10 applicants by patent filingsfor class H05, 2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG ELECTRONICS COMPANY KR 9,981
- SAMSUNG DISPLAY KR 5,041
- LG ELECTRONICS KR 4,742
- PHILIP MORRIS PRODUCTS CH 4,411
- PANASONIC INTELLECTUAL PROPERTY JP 3,915
- PANASONIC INTELLECTUAL PROPERTY 3,471
- SAMSUNG ELECTRO-MECHANICS COMPANY KR 3,210
- MURATA MANUFACTURING COMPANY JP 3,191
- FUJI JP 2,987
- SIGNIFY HOLDING NL 2,907