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CPC Subgroup Additional Only
H05K 2201/0137

Materials

Full Title

Indexing scheme relating to printed circuits covered by H05K1/00 > Dielectrics > Materials

10 direct subcodes

Child Classifications

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  • H05K 2201/0141 Liquid crystal polymer [LCP]
  • H05K 2201/0145 Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
  • H05K 2201/015 Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
  • H05K 2201/0154 Polyimide
  • H05K 2201/0158 Polyalkene or polyolefin, e.g. polyethylene [PE], polypropylene [PP]
  • H05K 2201/0162 Silicon containing polymer, e.g. silicone
  • H05K 2201/0166 Polymeric layer used for special processing, e.g. resist for etching insulating material or photoresist used as a mask during plasma etching
  • H05K 2201/017 Glass ceramic coating, e.g. formed on inorganic substrate
  • H05K 2201/0175 Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor
  • H05K 2201/0179 Thin film deposited insulating layer, e.g. inorganic layer for printed capacitor

Top Applicants

Top 10 applicants by patent filingsfor class H05, 2013–2023, worldwide · Source: EPO PATSTAT

  1. SAMSUNG ELECTRONICS COMPANY KR 9,981
  2. SAMSUNG DISPLAY KR 5,041
  3. LG ELECTRONICS KR 4,742
  4. PHILIP MORRIS PRODUCTS CH 4,411
  5. PANASONIC INTELLECTUAL PROPERTY JP 3,915
  6. PANASONIC INTELLECTUAL PROPERTY 3,471
  7. SAMSUNG ELECTRO-MECHANICS COMPANY KR 3,210
  8. MURATA MANUFACTURING COMPANY JP 3,191
  9. FUJI JP 2,987
  10. SIGNIFY HOLDING NL 2,907