CPC Subgroup Additional Only
H05K 2201/0137 Materials
Full Title
Indexing scheme relating to printed circuits covered by H05K1/00 > Dielectrics > Materials
10 direct subcodes
Child Classifications
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- H05K 2201/0141 Liquid crystal polymer [LCP]
- H05K 2201/0145 Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
- H05K 2201/015 Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
- H05K 2201/0154 Polyimide
- H05K 2201/0158 Polyalkene or polyolefin, e.g. polyethylene [PE], polypropylene [PP]
- H05K 2201/0162 Silicon containing polymer, e.g. silicone
- H05K 2201/0166 Polymeric layer used for special processing, e.g. resist for etching insulating material or photoresist used as a mask during plasma etching
- H05K 2201/017 Glass ceramic coating, e.g. formed on inorganic substrate
- H05K 2201/0175 Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor
- H05K 2201/0179 Thin film deposited insulating layer, e.g. inorganic layer for printed capacitor
Top Applicants
Top 10 applicants by patent filingsfor class H05, 2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG ELECTRONICS COMPANY KR 9,981
- SAMSUNG DISPLAY KR 5,041
- LG ELECTRONICS KR 4,742
- PHILIP MORRIS PRODUCTS CH 4,411
- PANASONIC INTELLECTUAL PROPERTY JP 3,915
- PANASONIC INTELLECTUAL PROPERTY 3,471
- SAMSUNG ELECTRO-MECHANICS COMPANY KR 3,210
- MURATA MANUFACTURING COMPANY JP 3,191
- FUJI JP 2,987
- SIGNIFY HOLDING NL 2,907