Layered conductors or foils

Full Title

Indexing scheme relating to printed circuits covered by H05K1/00 > Conductive materials > Structure of the conductor > Layered conductors or foils

Child Classifications

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• H05K 2201/0338 Layered conductor, e.g. layered metal substrate, layered finish layer or layered thin film adhesion layer
• H05K 2201/0341 Intermediate metal, e.g. before reinforcing of conductors by plating
• H05K 2201/0344 Electroless sublayer, e.g. Ni, Co, Cd or Ag; Transferred electroless sublayer
• H05K 2201/0347 Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
• H05K 2201/035 Paste overlayer, i.e. conductive paste or solder paste over conductive layer
• H05K 2201/0352 Differences between the conductors of different layers of a multilayer
• H05K 2201/0355 Metal foils
• H05K 2201/0358 Resin coated copper [RCC]
• H05K 2201/0361 Etched tri-metal structure, i.e. metal layers or metal patterns on both sides of a different central metal layer which is later at least partly etched