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CPC Subgroup Additional Only
H05K 2201/0364

Conductor shape

Full Title

Indexing scheme relating to printed circuits covered by H05K1/00 > Conductive materials > Structure of the conductor > Conductor shape

7 direct subcodes

Child Classifications

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  • H05K 2201/0367 Metallic bump or raised conductor not used as solder bump
  • H05K 2201/037 Hollow conductors, i.e. conductors partially or completely surrounding a void, e.g. hollow waveguides
  • H05K 2201/0373 Conductors having a fine structure, e.g. providing a plurality of contact points with a structured tool
  • H05K 2201/0376 Flush conductors, i.e. flush with the surface of the printed circuit
  • H05K 2201/0379 Stacked conductors
  • H05K 2201/0382 Continuously deformed conductors
  • H05K 2201/0385 Displaced conductors

Top Applicants

Top 10 applicants by patent filingsfor class H05, 2013–2023, worldwide · Source: EPO PATSTAT

  1. SAMSUNG ELECTRONICS COMPANY KR 9,981
  2. SAMSUNG DISPLAY KR 5,041
  3. LG ELECTRONICS KR 4,742
  4. PHILIP MORRIS PRODUCTS CH 4,411
  5. PANASONIC INTELLECTUAL PROPERTY JP 3,915
  6. PANASONIC INTELLECTUAL PROPERTY 3,471
  7. SAMSUNG ELECTRO-MECHANICS COMPANY KR 3,210
  8. MURATA MANUFACTURING COMPANY JP 3,191
  9. FUJI JP 2,987
  10. SIGNIFY HOLDING NL 2,907