Pads and lands

Full Title

Indexing scheme relating to printed circuits covered by H05K1/00 > Shape and layout > Shape and layout details of conductors > Pads and lands

Child Classifications

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• H05K 2201/09381 Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component
• H05K 2201/0939 Curved pads, e.g. semi-circular or elliptical pads or lands
• H05K 2201/094 Array of pads or lands differing from one another, e.g. in size, pitch or thickness; Using different connections on the pads
• H05K 2201/09409 Multiple rows of pads, lands, terminals or dummy patterns; Multiple rows of mounted components
• H05K 2201/09418 Special orientation of pads, lands or terminals of component, e.g. radial or polygonal orientation
• H05K 2201/09427 Special relation between the location or dimension of a pad or land and the location or dimension of a terminal
• H05K 2201/09436 Pads or lands on permanent coating which covers the other conductors
• H05K 2201/09445 Pads for connections not located at the edge of the PCB, e.g. for flexible circuits
• H05K 2201/09454 Inner lands, i.e. lands around via or plated through-hole in internal layer of multilayer PCB
• H05K 2201/09463 Partial lands, i.e. lands or conductive rings not completely surrounding the hole
• H05K 2201/09472 Recessed pad for surface mounting; Recessed electrode of component
• H05K 2201/09481 Via in pad; Pad over filled via
• H05K 2201/0949 Pad close to a hole, not surrounding the hole