Conductive through-holes or vias

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Indexing scheme relating to printed circuits covered by H05K1/00 > Shape and layout > Shape and layout details of conductors > Conductive through-holes or vias

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• H05K 2201/09509 Blind vias, i.e. vias having one side closed
• H05K 2201/09536 Buried plated through-holes, i.e. plated through-holes formed in a core before lamination
• H05K 2201/09545 Plated through-holes or blind vias without lands
• H05K 2201/09554 Via connected to metal substrate
• H05K 2201/09563 Metal filled via
• H05K 2201/09572 Solder filled plated through-hole in the final product
• H05K 2201/09581 Applying an insulating coating on the walls of holes
• H05K 2201/0959 Plated through-holes or plated blind vias filled with insulating material
• H05K 2201/096 Vertically aligned vias, holes or stacked vias
• H05K 2201/09609 Via grid, i.e. two-dimensional array of vias or holes in a single plane
• H05K 2201/09618 Via fence, i.e. one-dimensional array of vias
• H05K 2201/09627 Special connections between adjacent vias, not for grounding vias
• H05K 2201/09636 Details of adjacent, not connected vias
• H05K 2201/09645 Patterning on via walls; Plural lands around one hole