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CPC Subgroup Additional Only
H05K 2201/09609

Via grid, i.e. two-dimensional array of vias or holes in a single plane

Full Title

Indexing scheme relating to printed circuits covered by H05K1/00 > Shape and layout > Shape and layout details of conductors > Conductive through-holes or vias > Via grid, i.e. two-dimensional array of vias or holes in a single plane

Top Applicants

Top 10 applicants by patent filingsfor class H05, 2013–2023, worldwide · Source: EPO PATSTAT

  1. SAMSUNG ELECTRONICS COMPANY KR 9,981
  2. SAMSUNG DISPLAY KR 5,041
  3. LG ELECTRONICS KR 4,742
  4. PHILIP MORRIS PRODUCTS CH 4,411
  5. PANASONIC INTELLECTUAL PROPERTY JP 3,915
  6. PANASONIC INTELLECTUAL PROPERTY 3,471
  7. SAMSUNG ELECTRO-MECHANICS COMPANY KR 3,210
  8. MURATA MANUFACTURING COMPANY JP 3,191
  9. FUJI JP 2,987
  10. SIGNIFY HOLDING NL 2,907