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CPC Subgroup Additional Only
H05K 2201/10431

Details of mounted components

Full Title

Indexing scheme relating to printed circuits covered by H05K1/00 > Details of components or other objects attached to or integrated in a printed circuit board > Details of mounted components

10 direct subcodes

Child Classifications

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  • H05K 2201/10553 Component over metal, i.e. metal plate in between bottom of component and surface of PCB
  • H05K 2201/1056 Metal over component, i.e. metal plate over component mounted on or embedded in PCB
  • H05K 2201/10568 Integral adaptations of a component or an auxiliary PCB for mounting, e.g. integral spacer element
  • H05K 2201/10575 Insulating foil under component
  • H05K 2201/10583 Cylindrically shaped component; Fixing means therefore
  • H05K 2201/1059 Connections made by press-fit insertion
  • H05K 2201/10598 Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB
  • H05K 2201/10606 Permanent holder for component or auxiliary printed circuits mounted on a printed circuit board [PCB]

Top Applicants

Top 10 applicants by patent filingsfor class H05, 2013–2023, worldwide · Source: EPO PATSTAT

  1. SAMSUNG ELECTRONICS COMPANY KR 9,981
  2. SAMSUNG DISPLAY KR 5,041
  3. LG ELECTRONICS KR 4,742
  4. PHILIP MORRIS PRODUCTS CH 4,411
  5. PANASONIC INTELLECTUAL PROPERTY JP 3,915
  6. PANASONIC INTELLECTUAL PROPERTY 3,471
  7. SAMSUNG ELECTRO-MECHANICS COMPANY KR 3,210
  8. MURATA MANUFACTURING COMPANY JP 3,191
  9. FUJI JP 2,987
  10. SIGNIFY HOLDING NL 2,907