CPC Subgroup Additional Only
H05K 2201/10431 Details of mounted components
Full Title
Indexing scheme relating to printed circuits covered by H05K1/00 > Details of components or other objects attached to or integrated in a printed circuit board > Details of mounted components
10 direct subcodes
Child Classifications
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- H05K 2201/10439 Position of a single component
- H05K 2201/10507 Involving several components
- H05K 2201/10553 Component over metal, i.e. metal plate in between bottom of component and surface of PCB
- H05K 2201/1056 Metal over component, i.e. metal plate over component mounted on or embedded in PCB
- H05K 2201/10568 Integral adaptations of a component or an auxiliary PCB for mounting, e.g. integral spacer element
- H05K 2201/10575 Insulating foil under component
- H05K 2201/10583 Cylindrically shaped component; Fixing means therefore
- H05K 2201/1059 Connections made by press-fit insertion
- H05K 2201/10598 Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB
- H05K 2201/10606 Permanent holder for component or auxiliary printed circuits mounted on a printed circuit board [PCB]
Top Applicants
Top 10 applicants by patent filingsfor class H05, 2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG ELECTRONICS COMPANY KR 9,981
- SAMSUNG DISPLAY KR 5,041
- LG ELECTRONICS KR 4,742
- PHILIP MORRIS PRODUCTS CH 4,411
- PANASONIC INTELLECTUAL PROPERTY JP 3,915
- PANASONIC INTELLECTUAL PROPERTY 3,471
- SAMSUNG ELECTRO-MECHANICS COMPANY KR 3,210
- MURATA MANUFACTURING COMPANY JP 3,191
- FUJI JP 2,987
- SIGNIFY HOLDING NL 2,907