CPC Subgroup Additional Only
H05K 2201/10 Details of components or other objects attached to or integrated in a printed circuit board
Full Title
Indexing scheme relating to printed circuits covered by H05K1/00 > Details of components or other objects attached to or integrated in a printed circuit board
4 direct subcodes
Child Classifications
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- H05K 2201/10007 Types of components
- H05K 2201/10227 Other objects, e.g. metallic pieces
- H05K 2201/10431 Details of mounted components
- H05K 2201/10613 Details of electrical connections of non-printed components, e.g. special leads
Top Applicants
Top 10 applicants by patent filingsfor class H05, 2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG ELECTRONICS COMPANY KR 9,981
- SAMSUNG DISPLAY KR 5,041
- LG ELECTRONICS KR 4,742
- PHILIP MORRIS PRODUCTS CH 4,411
- PANASONIC INTELLECTUAL PROPERTY JP 3,915
- PANASONIC INTELLECTUAL PROPERTY 3,471
- SAMSUNG ELECTRO-MECHANICS COMPANY KR 3,210
- MURATA MANUFACTURING COMPANY JP 3,191
- FUJI JP 2,987
- SIGNIFY HOLDING NL 2,907