Components characterised by their electrical contacts

Full Title

Indexing scheme relating to printed circuits covered by H05K1/00 > Details of components or other objects attached to or integrated in a printed circuit board > Details of electrical connections of non-printed components, e.g. special leads > Components characterised by their electrical contacts

Child Classifications

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• H05K 2201/10628 Leaded surface mounted device
• H05K 2201/10636 Leadless chip, e.g. chip capacitor or resistor
• H05K 2201/10643 Disc shaped leadless component
• H05K 2201/10651 Component having two leads, e.g. resistor, capacitor
• H05K 2201/10659 Different types of terminals for the same component, e.g. solder balls combined with leads
• H05K 2201/10666 Plated through-hole for surface mounting on PCB
• H05K 2201/10674 Flip chip
• H05K 2201/10681 Tape Carrier Package [TCP]; Flexible sheet connector
• H05K 2201/10689 Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
• H05K 2201/10696 Single-in-line [SIL] package
• H05K 2201/10704 Pin grid array [PGA]
• H05K 2201/10712 Via grid array, e.g. via grid array capacitor
• H05K 2201/10719 Land grid array [LGA]
• H05K 2201/10727 Leadless chip carrier [LCC], e.g. chip-modules for cards
• H05K 2201/10734 Ball grid array [BGA]; Bump grid array