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PCE
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CPC Subgroup Additional Only
H05K 2201/10757

Bent leads

Full Title

Indexing scheme relating to printed circuits covered by H05K1/00 > Details of components or other objects attached to or integrated in a printed circuit board > Details of electrical connections of non-printed components, e.g. special leads > Details of leads > Shape details > Bent leads

2 direct subcodes

Child Classifications

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  • H05K 2201/10765 Leads folded back, i.e. bent with an angle of 180 deg
  • H05K 2201/10772 Leads of a surface mounted component bent for providing a gap between the lead and the pad during soldering

Top Applicants

Top 10 applicants by patent filingsfor class H05, 2013–2023, worldwide · Source: EPO PATSTAT

  1. SAMSUNG ELECTRONICS COMPANY KR 9,981
  2. SAMSUNG DISPLAY KR 5,041
  3. LG ELECTRONICS KR 4,742
  4. PHILIP MORRIS PRODUCTS CH 4,411
  5. PANASONIC INTELLECTUAL PROPERTY JP 3,915
  6. PANASONIC INTELLECTUAL PROPERTY 3,471
  7. SAMSUNG ELECTRO-MECHANICS COMPANY KR 3,210
  8. MURATA MANUFACTURING COMPANY JP 3,191
  9. FUJI JP 2,987
  10. SIGNIFY HOLDING NL 2,907